An assembly process transport carrier for FPC,COF,TCP,Flex-rigid,and thin PWB.
From ACF attachment to SMT to Molding, all processes can be done on the same carrier.(Transport carrier for processes before and after SMT.)
For device mounting and solder bump affixation and reflow carrier on interposer boards.
No need for heat resistant tape!
Adaptable to FPCs with uneven supports.
Endure 500 reflow cycles.
Registration accuracy of placement for substrate units is +/-30 microns.
Already in use with FPC,COF,CCD, and CMOS boards for cellular phones.
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Maxtors (Intertrade) Co., Ltd.
57/15 Soi Ramindra 34 (18/1) Yooyen Road Taraeng Sub-District
Bangkhen District Bangkok 10230 Thailand
Phone : +66 2 943 7590 - 91
Mobile : +66 81 453 9598
2019 Maxtors (Intertrade) Co., Ltd. All Rights Reserved. Designed By